? The machine is made of imported plates, which can work in the acidic and corrosive environment for a long time. It is sturdy and durable, and it has a double-layer leakage-proof design.

? Adopting SCI, SC2 effective treatment process equipment for organic and inorganic substances on the chip surface, it can clean 4〃, 5〃, 6〃, 8〃, 12〃 silicon wafers.

? Able to be designed with manual and full-automatic operation, and the full-automatic operation mode adopts multiple robot arm manipulators, which is more effective for improving efficiency and reducing costs.

? Cleaning capacity: for 4~6 inch wafers, 25 wafers *2 cassettes/lot, and for 8〃, 12〃, 25 wafers/lot.

? All-around alarm alert function, fool-proofing design function.

? Each process tank is of modularized design, with the etching tank and pure water flushing tank placed in the same leakage receiving tray.

The etching tank is designed with bottom air discharge to reduce the amount of exhaust air.

? The process tank can be designed with lifting operation for faster and more thorough cleaning.

? The control part adopts PLC and HMI from imported brands, and can be equipped with MES system.

? The front of the machine is equipped with a pure water gun and a nitrogen gun, which are placed on the right side.

? Equipment design standards comply with the semiconductor industry standard (SEMI-S2), and are regulated and guaranteed by the IS09001 quality management system.