1. Used for single-chip corrosion, cleaning, and brushing processes of semiconductor materials such as silicon, silicon carbide, and gallium nitride.
2. The machine can achieve multi size compatibility (4&6 inches; 6&8 inches; 8&12 inches).
3. The process chamber has been optimized with high-performance FFU and adjustable height CUP, forming a stable and strong downflow, strictly controlling the dynamic environment of the wafer surface process area.
4. It can achieve the separation and discharge of liquid medicine (acid/alkali/organic) without cross contamination of liquid medicine.
5. Suitable for substrate and epitaxial cleaning, PRstrip, Oxyremoval and other processes.
6. Supports GEM/SECS protocol and MES system online connection.
WuxiTel：0510-85853898
ShandongTel：0635-3999580
Phone：13671788984
Email：lsee@zglsee.com
Wuxi Base：Qingyun Building 3, No. 99 Furong Middle Third Road, Xishan Science and Technology Innovation Park, Wuxi City, Jiangsu Province
Shandong Base：No.1 Renhe West Road, Gaotang Development Zone, Shandong
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