Wafer tank-type immersion etching and cleaning, with a specially designed rotating cage for automatic rotation and self-rotation of wafers.

The process results feature high uniformity and consistency, ensuring the etching effect.

The entire process is controlled automatically, with an independently developed control system and a user-friendly human-machine interface.

Nitrogen bubbling function: during operation, the nitrogen pipeline can move uniformly in parallel in the acid tank, and the bubbling rate is adjustable.

Multi-stage fine filtration of chemical solutions, with functions of recycling and automatic liquid replenishment.

Capable of information interaction and communication with the MES system.

The chemical solution has an in-line heating, cooling and constant temperature function.

Equipped with a complete special device for wafer transfer.

Provide standard process solutions.

The cleaning machine protects the silicon wafers to the greatest extent through hardware and software configurations. In case of equipment downtime under abnormal conditions, the manipulator will be immediately activated to take out the silicon wafers from the chemical solution tank and place them in the QDR water tank for rinsing, so as to avoid excessive etching of the silicon wafers by the chemical solution. Under extreme conditions where the manipulator is down, the equipment will immediately drain the chemical solution from the chemical solution tank and then inject UPW, thereby also reducing excessive etching of the silicon wafers by the chemical solution.

Processing capacity: wafer diameter from 4 inches to 12 inches, with 75 pieces per batch for 6-inch wafers, and 50 pieces per batch for 8-inch/12-inch wafers.
Etching precision: flatness increment δTTV ≤ 1.5μm.
Application fields: wafer thinning, surface etching.